Indium Corporation is a world leader in the design, formulation, manufacture and supply of semiconductor-grade fluxes and associated materials, enabling 2.5 and 3D assembly …

Indium Corporation is the semiconductor materials leader (flux and solders) in SiP (system-in-package) assembly and heterogenous integration assembly. Our SiPaste® and fluxes have …

Indium Corporation’s Miloš Lazić, Technical Support Engineer, and Sze Pei Lim, Regional Manager, Semiconductor, discuss new technologies available for the semiconductor industry’s …

Applications include semiconductor integrated circuits, power QFNs, power device to PCB attach, telecom, die-attach, LED attach, and more. We provide custom solutions for your thermal …

Robust Tacking Agent for Power Electronics Assembly is a no-clean, no-residue, halogen-free material designed to affix solder preforms, chips, or dies in position after placement to prevent …

Copper pillar/solder microbumps are emerging as a standard flip-chip solder bump replacement in many parts of the semiconductor assembly industry, from standard chip-attach to power …

Indium Corporation provides solder pastes for MEMS assembly and lid-attach applications.

2012年4月4日 · Maria Durham, Indium’s new Technical Specialist in Semiconductor and Advanced Assembly Materials, has been doing some research on indium lead (In/Pb) solder …

2018年5月25日 · Summary: A new trend is now well-established in the semiconductor assembly industry— copper-pillars topped with solder microbumps are replacing the standard flip-chip …

2024年5月27日 · Indium Corporation ’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will deliver two technical presentations at the 11th …