such as lattices and web structures. Deposition-based processes in 3D printing, such as direct ink writing, would be able to work with these materials to create such structures, but these suffer from ...

Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on ...

Laith Altimime, President of SEMI Europe, discusses the challenges and opportunities facing the European semiconductor ...

College of Food Science, Fujian Agriculture and Forestry University, Fuzhou 350002, China State Key Laboratory of Chemical Resource Engineering, Beijing Advanced Innovation Center for Soft Matter ...

In this context, packaging structures with NC-based inks are getting increasingly under pressure,” said Dr Björn Ewig, head of technology, flexible packaging, EMEA, at Siegwerk. Although inks based on ...

The solution incorporates Siegwerk’s proprietary PU resin technology. Credit: Siegwerk. Siegwerk, a provider of printing inks and coatings for packaging and labels, has introduced a new nitrocellulose ...

The pharma industry has been facing increasing pressure in recent years to adopt eco-friendly practices without compromising product safety or efficacy. No longer just a buzzword, sustainability ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

If you can leverage chiplets and 3D-IC packaging to use existing interface IP in a 5nm chiplet ... “Variations in Vt can cause differences in switching speeds, which is compounded in the GAA structure ...

This new approach of using the combination of SMA mapping and JWST imaging to tease out the 3D structures of these objects gives scientists a fresh way to understand the final, dying stages of sun ...

Alboslani detailed this research in her presentation "X-ray echoes from Sgr A* reveal the 3D structure of molecular clouds in the Galactic Center" at the 245th meeting of the American Astronomical ...