“That’s using a passive interconnect structure, and it works off of common interfaces ... These interposers are designed using an IC design tool, and need STA and traditional IC methodologies applied.

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

And, the chip contains test structures for monitoring ... two other partners, will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate. “We are excited to achieve ...

GUC leads ASIC industry with GLink die-on-die interface IP using TSMC’s N5 and N6 processes. The IP design and simulation flows will soon be silicon-validated for different 3D IC packaging. "In 2021, ...