siliconsemiconductor1 小时
Rapidus begins installation of Japan’s first NXE:3800E EUV lithography machinery
A pilot line will begin at Rapidus’ IIM-1 in April 2025. A single-wafer process will be introduced for all manufacturing ...
AZoOptics on MSN3 小时
New Platform for Lightsail Membrane Characterization
Caltech researchers develop a platform to characterize ultrathin membranes for lightsails, advancing the quest for ...
New Electronics8 小时
OKI achieves 3D integration of thin-film analogue ICs
OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.