This futuristic vision is becoming a reality thanks to a tiny, powerful sensor developed by researchers at Aalto University in Finland. The breakthrough technology, described in Science Advances, ...
Researchers at Pennsylvania State University recently developed highly compact near-sensor computing chips via the heterogeneous M3D integration of two-dimensional (2D) materials. Their paper ...
PVTSENU28HPCP is an IP for process voltage and temperature sensing of the silicon chip die. It has unique features like voltage and temperature probes without needing dedicated analog current and ...