EDN23d
As edge speeds increase, wires become transmission lines
Behind the need for improved understanding are today's ICs, which produce signals that rise and fall so rapidly that they cause interconnections to behave as transmission lines. This behavior can ...
Nature6d
Three-Dimensional Integrated Circuit Technology
This work highlights the importance of addressing manufacturing imperfections to ensure the reliability of 3D ICs. Finally, accurate characterization of S-parameters for vertical interconnections ...
Nature6d
Through Silicon Via Technology in 3D Integrated Circuits
Through Silicon Via (TSV) technology is a critical advancement in the field of 3D Integrated Circuits (3D ICs), enabling vertical interconnections between different layers of silicon chips.