Once he has the solder paste on, he places the components using ... [Colin] uses a microscope to do some inspection of the board, although the BGA could have concealed faults that would be hard ...

From there, some general soldering tools like flux and solder wick, a stencil for your chip, BGA balls, and a $20 USB-C hotplate are instrumental for reballing chips – tools you ought to have.

The Reverse Hybrid process utilizes SAC (Sn-Ag-Cu) solder paste and BGA components with LTS (Low Temperature Solder) balls. Using a SAC reflow profile, this innovative method forms homogeneous ...

It is generally agreed that, on average, 40% to 60% of the defects generated by a surface mount production line can ...